YAMAHA multi-function chip mounter YAMAHAYV100XGP
High speed and high precisionmulti-function modular placement machine
0.18 seconds/CHIP ultra-high-speed SMT(best conditions) 16200 CPH (grain per hour)
IPC9850 state, the patch speeds of up to16200 CPH (equivalent to 0.22 seconds/CHI
0603 components, the accuracy of plus orminus 50 microns, it repeat precision up to plus or minus 30 microns
The applicable scope is big, from 0201(English) miniature components to 31 MMQFP large components are applicable
Use two more high resolution digital cameravision
Continuous full welded ball of CSP/BGAcomponent identification, containing judge the defect in the welding ball agood no
Can choose with YAMAHA patent flight inmouth, can effectively reduce the idling loss
The best choice for universal affordable
Ends around Y axis by the power abused andhigh rigidity of servo screw drive, the new development of completely fixeddouble drive technology, improve the speed and drive through coordinationsynchronization at the ends of the, improve the function of acceleration,shortened the time orientation.
Detailed parameters:
Substrate size: M type: L460 * W335 (MAX) -L50 * W50 (MIN)
L: L460 * W440 (MAX) – L50 * W50 (MIN)
SMT precision: absolute accuracy (mu + 3sigma) : + / – 0.05 mm/chip, plus or minus 0.05 mm/QFP
Mount speed: 0.18 seconds 1.7seconds/CHIP/QFP, 1608 / CHIP: 16200 CPH
Components:can be pasted on the 0603-31 mm components, SOP/SOJ/QFP/connectors/PLCC/CSP/BGA
Dimension: 1650 * 1408 * 1650
The host weight: 1600 kg